Leaded Solder Paste
Solder Paste
At Aarkay under UZHI brand we are manufacturing high quality Solder Paste for various applications in different-2 alloy composition.
Our Solder Paste has good Printing and rolling performance and leak printing performance even the spacing of solder pad is low to 0.4mm , can also complete a exquisite printing. Can complete continuous printing for a long time almost without collapse after printing for a few hours small viscosity change SMD Components are not easy to move.
Excellent soldering performance can complete a good wetting in different parts
Less residue after soldering transparent appearance high insulation resistance do not corrode the PCB and meet the disposable requirement. Better ICT Test performance will not appear the false judgement.
We have Leaded & Lead Free Solder Paste available in different -2 alloy Compositions, reference table given below if needed other than this please let us know, products are available in different -2 ball sizes as per the need of customer.
| Tin Powder Code | Code | Diameter | Applicable Clearance |
|---|---|---|---|
| 2 | -200+400 | 38-74 | Standard Clearance (<25mil/0.65mm) |
| 3 | -325+500 | 25-45 | Small Clearance (<20MIL/0.50MM) |
| 4 | -400+625 | 20-38 | Extreme Small Clearance (<16mil/0.40mm) |
| 5 | -500+900 | 15-25 | Extreme Small Clearance (,8mil/0.20MM) |
Performance Parameter
Leaded Solder Paste
| Type | Alloy | Melting Point | Flux Content | Features |
|---|---|---|---|---|
| UZ 63/37 | Sn 63 Pb 37 | 183°C | 10.5±1% | Good Welding Activation, Excellent Auxiliary Stretching |
| UZ-37/02 | Sn62.9-Pb36.9-Ag0.2 | 183°C | 10.5±1% | " |
| UZ-36/02 | Sn62.9-Pb36.9-Ag0.4 | 183°C | 10.5±1% | " |
| UZ 55/45 | Sn 55 /Pb 45 | 183°C-203°C | 10.5±1% | Good Welding Strength & Reliable Joint |
Lead Free Solder Paste
| Type | Alloy | Melting Point | Powder Shape | Flux Content | Features |
|---|---|---|---|---|---|
| UZ 03/05 | Sn 96.5-Ag 3-Cu 0.5 | 217°C | ≥95% | 11.5±1% | High Welding Performance and good looks can probe non brittle residue low initiation rate. |
| UZ 00/07 | Sn 99-Ag 0.3-Cu 0.7 | 217°C-227°C | ≥95% | 11.5±1% | - |
| UZ 35/10 | Sn -64 Bi -35 Ag -1 | 151°C-189°C | ≥95% | 10.5±1% | Moderate Temp, high cost performance, good soldering Joint. |
| UZ 35/03 | Sn 64.7 Bi 35 Ag 0.3 | 172°C | ≥95% | 10.5±1% | - |
| UZ 42/58 | Sn 42-Bi 58 | 138°C | ≥95% | 10.5±1% | Suitable for devices need low temp soldering. |
Aarkay Associate
Headquarters
Aarkay is one of the most trusted name for adhesives in Lighting
