Athermal interface material (shortened to TIM) is anymaterialthat is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device. As this decade sees the trend of electronic components size reduced with ongoing pace it made Thermal interface materials indispensable part of Electronics Design Part.

TIM solutions these days are indispensable for Any new product development in electronics field. Application of TIM is essential where more then one heat path is involved. Surface of Standard Machine parts are either rough or wavy which practicallyreduce the contact points between two surfaces. These multiple voids between two surfaces create the thermal barrier to overcome this thermalinterface materials comes in picture. The Industryofwhich ThermalManagement caters is quite wide Electronics, LED Lighting, SolarInverters etc.